Review of the forum on printing, packaging and coating technologies with a focus on artificial intelligence
On 8 November 2025, innoPRINT Leipzig 2025 - the annual forum for current developments in printing, packaging and coating technologies - took place in the Gutenberg Building at HTWK Leipzig. This year's event was all about artificial intelligence and its opportunities for creativity, production and research.
In exciting specialist presentations, representatives from industry and science showed how AI is already optimising processes and opening up new avenues in the printing and packaging industry. Topics such as AI in the creative environment, smart production planning and innovative applications in the packaging industry provided plenty of topics for discussion and stimuli for interdisciplinary dialogue.
Students from HTWK Leipzig also used the stage to present their current research work. Their contributions ranged from standardised LCA data acquisition and printed thermal sensors for flexible electronics to innovative label-on-chip systems for point-of-care analyses. They thus impressively demonstrated the breadth and practical relevance of the HTWK degree programmes in the field of printing, packaging and surface technologies.
Once again, innoPRINT 2025 showed that innovation is born where science, technology and creativity meet - and HTWK Leipzig offers the ideal environment for this.
Save-the-Date
The next innoPRINT Leipzig symposium will take place on Friday, 6 November 2026 from 2 p.m. at HTWK Leipzig.
