Corrugated cardboard flutes
Practical modelling and validation of the relationships between the material properties of corrugated board, the parameters of the creasing tools and the creasing result, in order to specifically achieve the required properties in a crease and to be able to make well-founded quality assessments
Duration: 1 June 2021 – 31 May 2023
Funding: Federal Ministry for Economic Affairs and Climate Action (BMWi)
Material characterisation for more efficient use of materials and improved quality
The functionality of corrugated cardboard packaging depends to a large extent on the design of the box edges created by creasing and bending or folding, both in terms of a flawless appearance and in terms of strength and the hinge effect of the creases. The aim of this research project is to develop a practical knowledge base that describes the creasing behaviour of corrugated board in relation to material characteristics and creasing conditions. The result will be a practical evaluation concept for corrugated board with regard to creasability.
To achieve the research objective, extensive material investigations are required to characterise the materials and the creasing behaviour, including the evaluation of results. Based on the resulting database, the main factors influencing creasing behaviour will be identified using sensitivity analysis. Based on these findings, a mathematical-statistical model will be developed, along with a finite element model (FEM) for numerical simulation, enabling the creasing behaviour of corrugated board to be predicted. The benefits for SMEs extend across the entire ‘corrugated packaging’ value chain and are aimed overall at more efficient material utilisation and improved quality.
The results are transferred to industry through specialised training events and discussion forums with industrial partners, as well as through our own print and electronic publications.
Publications and presentations
Upcoming presentations and publications:
- Presentation at the PTS Corrugated Board Symposium (23–24 November 2022)
- Presentation at the Printing and Processing Symposium (29–30 November 2022)



